Metal Nanoparticles Based Inkjet Ink for Advanced Circuit Board Application
DOI:
https://doi.org/10.12974/2311-8792.2017.05.1Keywords:
Metal nanoparticles, silver, copper, Cu/Ag core/shell, conductive ink, printed circuit.Abstract
This study investigates the synthesis of mono metallic (copper and silver) and bi-metallic (copper/silver core/shell) conductive nanopigments for inkjet printing. Polyethylene glycol (PEG) was used as a main reducing agent followed by polyvinylpyrrolidone (PVP) as a capping and dispersing agent. From the XRD, TEM, and SEM analyses, the synthesized mono and bi metallic particles were con?rmed to be in a nano scale with particle size 7, 8.5 and 15.5 nm for copper, silver and copper/silver core/shell, respectively. The prepared nanopigments were included in inkjet ink formulation and printed on flexible polyethylene terephthalate (PET) films. The printed ink films were sintered at various temperatures (110, 150, 200). The results revealed that the resistivity of these particles was reduced by sintering and the resistivity of Cu, Ag and Cu/Ag patterns sintered in air at 200 ºC for 30 min were 3.1, 2.99 and 4.14 µ?-cm, respectively. The obtained results were in a good agreement with the published ones and insured the promising using of our products in metal-based inkjet printed circuit boards (PCB).
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